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 HD74SSTV16857A
1:1 14-bit SSTL_2 Registered Buffer
REJ03D0831-0100 (Previous: ADE-205-695) Rev.1.00 Apr 07, 2006
Description
The HD74SSTV16857A is a 14-bit registered buffer designed for 2.3 V to 2.7 V Vcc operation and LVCMOS reset (RESET) input / SSTL_2 data (D) inputs and CLK input. Data flow from D to Q is controlled by differential clock pins (CLK, CLK) and the RESET. Data is triggered on the positive edge of the positive clock (CLK), and the negative clock (CLK) must be used to maintain noise margins. When RESET is low, all registers are reset and all outputs are low. To ensure defined outputs from the register before a stable clock has been supplied, RESET must be held in the low state during power up.
Features
* * * * Supports LVCMOS reset (RESET) input / SSTL_2 data (D) inputs and CLK input Differential SSTL_2 (Stub series terminated logic) CLK signal Flow through architecture optimizes PCB layout Ordering Information
Part Name HD74SSTV16857ATEL HD74SSTV16857ANEL Package Type TSSOP-48 pin TVSOP-48 pin Package Code (Previous code) PTSP0048KA-A (TTP-48DBV) PTSP0048LA-A (TTP-48DEV) T N Package Abbreviation Taping Abbreviation (Quantity) EL (1,000 pcs / Reel) EL (1,000 pcs / Reel)
Note: Please consult the sales office for the above package availability.
Function Table
Inputs RESET L H H H H: L: X: : : Note: CLK X L or H CLK X H or L D X H L X Output Q L H L Q0
*1
High level Low level Immaterial Low to high transition High to low transition 1. Output level before the indicated steady state input conditions were established.
Rev.1.00 Apr 07, 2006 page 1 of 10
HD74SSTV16857A
Pin Arrangement
Q1 1 Q2 2 GND 3 V DDQ 4 Q3 5 Q4 6 Q5 7 GND 8 V DDQ 9 Q6 10 Q7 11 V DDQ 12 GND 13 Q8 14 Q9 15 V DDQ 16 GND 17 Q10 18 Q11 19 Q12 20 V DDQ 21 GND 22 Q13 23 Q14 24
48 D1 47 D2 46 GND 45 V CC 44 D3 43 D4 42 D5 41 D6 40 D7 39 CLK 38 CLK 37 V CC 36 GND 35 V REF 34 RESET 33 D8 32 D9 31 D10 30 D11 29 D12 28 V CC 27 GND 26 D13 25 D14
(Top view)
Rev.1.00 Apr 07, 2006 page 2 of 10
HD74SSTV16857A
Absolute Maximum Ratings
Item Supply voltage Input voltage *1 Output voltage *1, 2 Input clamp current Output clamp current Continuous output current VCC, VDDQ or GND current / pin Maximum power dissipation at Ta = 55C (in still air) Storage temperature Notes: Symbol VCC or VDDQ VI VO IIK IOK IO ICC, IDDQ or IGND PT Tstg Ratings -0.5 to 3.6 -0.5 to VDDQ+0.5 -0.5 to VDDQ+0.5 50 50 50 100 115 -65 to +150 Unit V V V mA mA mA mA C / W C Conditions
VI < 0 or VI > VCC VO < 0 or VO > VDDQ VO = 0 to VDDQ TSSOP
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 1. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. 2. This current will flow only when the output is in the high state and VO > VDDQ.
Recommended Operating Conditions
Item Supply voltage Output supply voltage Reference voltage Termination voltage Input voltage AC high level input voltage AC low level input voltage DC high level input voltage DC low level input voltage High level input voltage Low level input voltage Differential (Common mode range) input voltage (Minimum peak to
peak input)
Symbol VCC VDDQ VREF VTT VI VIH VIL VIH VIL VIH VIL VCMR VPP IOH IOL Ta
Min VDDQ 2.3 1.15 VREF-40 mV 0 VREF+310 mV -- VREF+150 mV -- 1.7 -0.3 0.97 360 -- -- 0
Typ 2.5 2.5 1.25 VREF -- -- -- -- -- -- -- -- -- -- -- --
Max 2.7 2.7 1.35 VREF+40 mV VCC -- VREF-310 mV -- VREF-150 mV VDDQ+0.3 0.7 1.53 -- -20 20 70
Unit V V V V V V V V V V V V mV mA mA C
Conditions
VREF = 0.5 x VDDQ
D D D D RESET RESET CLK, CLK CLK, CLK
High level output current Low level output current Operating temperature
Note: The RESET input of the device must be held at VDDQ or GND to ensure proper device operation. The differential inputs must not be floating, unless RESET is low.
Rev.1.00 Apr 07, 2006 page 3 of 10
HD74SSTV16857A
Logic Diagram
*1
RESET CLK CLK D1
34 38 39 48
1D C1
35
1
Q1
VREF
R
To thirteen other channels
Note:
1. RESET input gate is connected to VDDQ.
Electrical Characteristics
Item Input diode voltage Output voltage Symbol VIK VOH VOL Input current (All inputs) Quiescent supply current Standby current Dynamic operating clock only IIN ICC
*2
VCC (V) 2.3
Min --
Typ -- -- -- -- -- -- 25 -- 38
Max -1.2 -- VDDQ 0.2 0.35 5 45 10 45
Unit V V
Test Conditions IIN = -18 mA IOH = -100 A IOH = -16 mA IOL = 100 A IOL = 16 mA VIN = 2.7 V or 0 VIN = VIH(AC) or VIL(AC), IO = 0 RESET = GND RESET = VCC, VI = VIH(AC) or VIL(AC),
CLK and CLK switching 50%
2.3 to 2.7 VCC-0.2 2.3 1.95 2.3 to 2.7 -- 2.3 0 2.7 -- 2.7 -- 2.7 2.7 -- --
A mA A A/ clock MHz A/ clock MHz/ data input
ICC (stdy) ICCD *2
duty cycle Dynamic operating per each data input ICCD
*2
2.7
--
11
15
RESET = VCC, VI = VIH(AC) or VIL(AC),
CLK and CLK switching 50% duty cycle. One data input switching at half clock frequency, 50% duty cycle.
Output high *3 Output low *3 rOH - rOL each *3 separate bit Input capacitance Notes: 1. 2. 3. 4. Data inputs
CLK and CLK
rOH rOL rO() CIN
2.3 to 2.7 2.3 to 2.7 2.5 2.5 *1
7 7 -- 2.5 2.5 --
-- -- -- -- -- 3.0
20 *4 20 *4 4 3.5 3.5 --
pF
IOH = -20 mA IOL = 20 mA IO = 20 mA, Ta = 25C VI = VREF310 mV
VCMR = 1.25 V, VPP = 360 mV
RESET
VI = VCC or GND
All typical values are at VCC = 2.5 V, Ta = 25C. Total ICC (max) = ICC + {ICCD (clock)xf(clock)} + {ICCD (Data)x1/2f(clock)x14} This is effective in the case that it did terminate by resistance. See figure. 1, 2.
Rev.1.00 Apr 07, 2006 page 4 of 10
HD74SSTV16857A
Switching Characteristics
Item Clock frequency *1 Setup time Fast slew rate *4, 6 Slow slew rate *5, 6 Hold time Fast slew rate *4, 6 Slow slew rate *5, 6 Differential inputs active time Differential inputs inactive time Symbol fclock tsu th tact tinact VCC = 2.5 0.2 V Min Max -- 200 0.75 -- 0.9 -- 0.75 -- 0.9 -- 22 -- 22 -- Unit MHz ns ns ns ns Test Condition Data before CLK, CLK Data after CLK, CLK Data inputs must be low after RESET high. Data and clock inputs must be held at valid levels (not floating) after RESET low. CLK, CLK "H" or "L"
Pulse width Output slew *3
tw tSL
2.5 1
-- 4
ns volt/ns
(CL = 30 pF, RL = 50 , VREF = VTT = VDDQ x 0.5)
Item Maximum clock frequency Propagation delay time Notes: 1. 2. 3. 4. 5. 6.
*2
Symbol fmax
VCC = 2.50.2 V Min 200 Typ -- Max --
Unit MHz
FROM (Input)
TO (Output)
tPLH, tPHL 1.1 -- 2.8 ns CLK, CLK Q tPHL -- -- 5.0 RESET Q Although the clock is differential, all timing is relative to CLK going high and CLK going low. This timing relationship is specified into test load (see waveforms - 3, 4) with all of the outputs switching. Assumes into an equivalent, distributed load to the address net structure defined in the application information provided in this specification. For data signal input slew rate 1 V/ns. For data signal input slew rate 0.5 V/ns and < 1 V/ns. CLK, CLK signals input slew rates are 1 V/ns.
Rev.1.00 Apr 07, 2006 page 5 of 10
HD74SSTV16857A
Test Circuit
VTT
*2
50 Test point
*1
C L = 30 pF
Notes:
1. CL includes probe and jig capacitance. 2. VTT = VREF = VDDQ x 0.5
Waveforms - 1
LVCMOS RESET Input VCC VCC /2 tinact
*1
VCC /2 0V tact 90 % 10 % I CCH I CCL
I CC
Waveforms - 2
tw VIH Input VREF VREF VIL
Timing input
VCMR
VPP
tsu
th VIH
Input
VREF
VREF VIL
Rev.1.00 Apr 07, 2006 page 6 of 10
HD74SSTV16857A Waveforms - 3
Timing input VCMR VCMR VPP
tPLH
tPHL V OH
Output
VTT
VTT VOL
Waveforms - 4
LVCMOS RESET Input VIH VCC /2 VIL tPHL VOH Output VTT VOL
Notes:
1. ICC tested with clock and data inputs held at VCC or GND, and IO = 0 mA. 2. All input pulses are supplied by generators having the following characteristics : PRR 10 MHz, Zo = 50 , input slew rate = 1 V/ns 20% (unless otherwise specified). 3. The outputs are measured one at a time with one transition per measurement. 4. VTT = VREF = VDDQ/2 5. VIH = VREF+310 mV (AC voltage levels) for differential inputs. VIH = VCC for LVCMOS input. 6. VIL = VREF-310 mV (AC voltage levels) for differential inputs. VIL = GND for LVCMOS input. 7. tPLH and tPHL are the same as tpd
Rev.1.00 Apr 07, 2006 page 7 of 10
HD74SSTV16857A
Application Data
* Pull-down
100
80
Current (Amps)
60
40
20
Min Max
0 0.0 0.5 1.0 1.5 2.0 2.5 3.0
Voltage (V)
Figure 1
* Pull-up
0.0 0 0.5 1.0
Voltage (V)
1.5 2.0 2.5 Min Max 3.0
-20
Current (Amps)
-40
-60
-80
-100
Figure 2
Rev.1.00 Apr 07, 2006 page 8 of 10
HD74SSTV16857A
Curve Data
Pull-down Voltage (V) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 I (mA) Min 0 6 11.5 16 20 23 27 30.5 34 36.5 38.5 40 42 43 44 44 45 45 45 45 45 46 46 46 46 46 46 46 I (mA) Max 0 7 15 22 29 35.5 41.5 48 54 59 65 70 75 79 82 84.5 87 89 90 90 91 91 91 91 91.5 92 92 92 I (mA) Min 0 -6 -11.5 -16 -20 -23.5 -28 -31.5 -35 -38 -41 -44 -46 -48 -50 -51 -52 -52 -52.5 -53 -53 -53.5 -54 -54 -54 -54.5 -55 -55 Pull-up I (mA) Max 0 -7 -13 -19 -25 -31 -37 -42 -47 -53 -58 -62 -66 -71 -74 -77 -81 -84 -86 -89 -91 -92 -93 -94 -95 -96.5 -98 -99
Rev.1.00 Apr 07, 2006 page 9 of 10
HD74SSTV16857A
Package Dimensions
JEITA Package Code P-TSSOP48-6.1x12.5-0.50 RENESAS Code PTSP0048KA-A Previous Code TTP-48DBV MASS[Typ.] 0.2g
*1
D F 25
48
bp
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
Index mark
*2
HE
E
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
c
24 bp L1 x M
Reference Dimension in Millimeters Symbol
A1
y
L
Detail F
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Min Nom Max 12.5 12.7 6.10
0.08 0.13 0.18 1.20 0.14 0.19 0.24 0.10 0.15 0.20 0 8 7.90 8.10 8.30 0.50 0.08 0.10 0.65 0.4 0.5 0.6 1.0
JEITA Package Code P-TSSOP48-4.4x9.7-0.40
RENESAS Code PTSP0048LA-A
Previous Code TTP-48DEV
MASS[Typ.] 0.077g
*1
D 25
A
F
48
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
E
Index mark
*2
Terminal cross section ( Ni/Pd/Au plating )
Reference Dimension in Millimeters Symbol
c
1 Z e
*3
24 bp L1 x M
A1
y
L
Detail F
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Min Nom Max 9.70 9.90 4.40
A
0.05 0.10 0.15 1.20 0.13 0.18 0.23 0.10 0.15 0.20 0 8 6.20 6.40 6.60 0.40 0.07 0.08 0.40 0.40 0.50 0.60 1.00
Rev.1.00 Apr 07, 2006 page 10 of 10
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
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Colophon .6.0


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